| 摘要 |
PURPOSE: A method for bonding probes is provided to perform an arrangement for neighboring probes by bonding the probes to an interconnection element on the circuit pattern of a substrate. CONSTITUTION: A substrate on which a circuit pattern is formed is prepared(S100). An interconnection element including a first side and a second side is prepared(S200). The interconnection element is bonded to the circuit pattern(S300). The second side of the interconnection element is polished(S500). Probes are arranged on the second side. Probes are bonded to the interconnection element(S700).
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