| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for surly forming a wiring board that is excellent in adhesion property between insulation layers, and between the insulation layer and a wiring conductor, and excellent in electrical insulation reliability between wiring conductors. <P>SOLUTION: The method of manufacturing the wiring board includes: a step of adhering a resin film 2 on the main surface of an insulation sheet 1 being the insulation layer 11 of the wiring board 10 with an adhesive layer 3; a step of forming a through-hole 4 into the insulation sheet 1 to which the resin film 2 is adhered with the adhesive layer 3 wherein the insulation sheet 1 is opened the through-hole together with the resin film 2 and the adhesive layer 3; a step of filling the through-hole 4 with conductive paste 5; and a step of removing the resin film 2 together with the adhesive layer 3 from the main surface of the insulation sheet 1 having the through-hole 4 filled with the conductive paste 5. The adhesive layer 3 includes a colored adhesive layer 3a on a side contacting with the resin film 2, and a colorless adhesive layer 3b on a side contacting with the insulation sheet 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
