| 摘要 |
PURPOSE: A semiconductor device is provided to prevent the separation between lead and sealing resin by improving adhesion of lead and sealing resin(mold resin), thereby increasing reliability. CONSTITUTION: A semiconductor device(1) comprises: a semiconductor chip; a plurality of leads including a metal as a main constitutional material, electrically connected with the semiconductor chip; and a resin for sealing the semiconductor chip, wherein the plurality of leads each have an outer lead portion exposed from the resin and an inner lead portion embedded in the resin, and the resin contains an aromatic compound having a benzene ring and/or a compound having a cyclohexane ring, and the benzene ring and/or the cyclohexane ring contained in the resin and a metal atom which is a main constitutional material of a surface material of the inner lead portion are arranged so as to be superposed one on the other at an interface at which the surface material of the inner lead portion and the resin are in contact with each other. |
