发明名称 STRUCTURE FOR ATTACHING COMPONENT HAVING HEATING BODY MOUNTED THEREON
摘要 Provided is a structure for attaching a component having a heating body mounted thereon, wherein sizes are reduced and heat dissipating efficiency is improved by improving heat conduction efficiency. A plurality of protruding sections are formed on an attaching surface of a base plate (10), and the base plate (10) is attached to a heat dissipating member (17) by arranging a heat conductive sheet (18) formed of a material softer than the base plate (10) in between.
申请公布号 KR20100025546(A) 申请公布日期 2010.03.09
申请号 KR20097027401 申请日期 2008.12.10
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HASEGAWA TSUYOSHI
分类号 H01L23/36 主分类号 H01L23/36
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