| 摘要 |
<p>A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include adhering a film to an insulation base, in which the film is configured to flatten a surface of the insulation base, thermosetting the film, and forming a circuit pattern on the film by way of ink-jetting. In accordance with the present invention, a surface of the insulation base can be flattened and the surface roughness thereof can be made uniform, so that the diffusivity of the circuit pattern can be controlled while printing a minute circuit pattern and an adhesive strength between the insulation base and the circuit pattern can be increased.</p> |
