LASER MACHINING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a laser machining apparatus with simple constitution usable in various applications without changing its design.

SOLUTION: The laser machining apparatus includes: a plurality of semiconductor lasers 4; a condensing member for condensing laser light emitted from the semiconductor lasers 4 to a workpiece; the laser holding members 7 for holding the respective semiconductor lasers 4; and the mounting members 8 for mounting the laser holding members 7. A projectingly-curved surface 21c is formed to the laser holding member 7, and a recess-curved surface 23b abutting on the projectingly-curved surface 21c is formed to the mounting member 8.

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