发明名称 |
MULTIPLE CAVITY/COMPARTMENT PACKAGE |
摘要 |
A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. In one embodiment the present invention is a multi-cavity package having at least one substrate forming at least one cavity with the substrate coupled to a shelf within the sidewalls of the package. |
申请公布号 |
EP1665374(A4) |
申请公布日期 |
2010.03.03 |
申请号 |
EP20040781690 |
申请日期 |
2004.08.19 |
申请人 |
DELAWARE CAPITAL FORMATION, INC. |
发明人 |
STEVENS, DANIEL, S.;MINK, JEFFREY, T. |
分类号 |
H01L23/02;H01L;H01L23/055;H01L23/538;H01L25/065;H01L25/10;H01L25/16 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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