发明名称 HEAT INSULATION BOARD FOR BUILDING, FLOOR HEAT-INSULATION STRUCTURE AND METHOD FOR FORMING THE FLOOR HEAT-INSULATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To easily align a position of a top surface of a heat insulation board 1 for a building with positions of top surfaces of floor structural members 2 and 2 irrespective of the thickness of the floor structural members 2 and 2 when the heat insulation board 1 for a building is fitted and installed between the juxtaposed floor structural members 2 and 2. SOLUTION: In this heat insulation board 1 for a building, a synthetic resin foamed board with a width equivalent to an interval between the floor structural members 2 and 2 in which the board is fitted and installed is split into a central main material portion 3 as a central portion, and supporting material portions 4 and 4 as both side edges facing each other in a width direction, via an obliquely-inward cut. The supporting material portions 4 and 4 are mounted on the side surfaces of the opposed floor structural members 2 and 2, so that the central main material portion 3 can be installed between the supporting material portions 4 and 4, mounted on the floor structural members 2 and 2, in such a manner that cut surfaces 6 and 6 of the supporting material portions 4 and 4 and cut surfaces 5 and 5 of the central main material portion 3, which are formed by the cut, overlap one another. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010043423(A) 申请公布日期 2010.02.25
申请号 JP20080206687 申请日期 2008.08.11
申请人 DOW KAKOH KK 发明人 NISHIMURA KUNITAKA
分类号 E04B1/80 主分类号 E04B1/80
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