| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connect board without deteriorating the characteristics of a built-in electronic component and hardly restricted by the performance such as capacitance of the built-in electronic component. Ž<P>SOLUTION: A first board member 10 is overlaid on a second board member 20. In the first board member 10, a probe pin pad 13 is formed on a major surface 12 and a first contact electrode pad 14 is formed on a surface of opposite thereto, the pad 13 is connected with the first contact electrode pad 14 via a through-conductor part 11, and a land 15 for mounting component to be connected to the adjacent through-conductor part 11 is formed on the surface opposite the major surface 12. In the second board member 20, a motherboard connection pad 23 is formed on a major surface 22 and a second contact electrode pad 24 formed on a surface opposite thereto, and the pad 23 is connected with the second contact electrode pad 24 via a through-conductor part 21. A bypass capacitor 30 connected between the lands 15 for mounting component is housed in a mounting component housing recessed part 25 formed on a surface opposite the major surface 22. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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