| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaving device that cleaves a substrate to a width less than the thickness of the substrate. Ž<P>SOLUTION: The substrate 100 is supported in a cantilever state by a first member 18a and a second member 18b of a support means 18, and a push rod 10a is pressed to cleave the substrate at the position of a groove 108. The push rod 10a has an elastic member 24 disposed nearby its chip. Further, an operating member 26 is connected to the elastic member 24, and when the push rod 10a is pressed against the substrate 100, the operating member 26 comes into contact with the substrate 100. Further, slopes having an angle θ being θ>α are formed at ends of the first member 18a and second member 18b on the side of a position detecting mechanism 12, where NA is the numerical aperture of an objective lens of an imaging apparatus constituting the position detecting mechanism 12 and a state observation mechanism 20 and NA=sinα. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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