发明名称 |
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7. |
申请公布号 |
US2010044094(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20080518398 |
申请日期 |
2008.01.16 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
发明人 |
OKA YOSHIO;PARK JINJOO;MAEDA KAZUYUKI;YAGI NARITO;SHIMOMURA TETSUYA;NISHIKAWA JUNICHIRO |
分类号 |
H05K1/11;H05K3/10 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|