发明名称 |
SILICONE RESIN COMPOSITION, SILICONE RESIN USING THE SAME AND OPTICAL SEMICONDUCTOR SEALED-BODY |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicone resin composition excellent in productivity and capable of being converted into a silicon resin excellent in surface tackiness. <P>SOLUTION: This silicone resin composition includes: (A) a polysiloxane having at least two alkenyl groups bonded to a silicon atom; (B) a polysiloxane crosslinker having at least two hydrogen groups bonded to a silicon atom; (C) at least one organic metal compound selected from the group consisting of an organic zirconyl compound having an organic group of 3 or more carbon atoms, an organic zinc compound, an organic magnesium compound and an organic potassium compound, and there are provided also a silicone resin obtained by curing the silicone resin composition and an optical semiconductor element sealed-body in which an LED chip is sealed with the silicone resin. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010043136(A) |
申请公布日期 |
2010.02.25 |
申请号 |
JP20080206059 |
申请日期 |
2008.08.08 |
申请人 |
YOKOHAMA RUBBER CO LTD:THE |
发明人 |
TAKEI YOSHIHITO;ISHIKAWA KAZUNORI |
分类号 |
C08L83/07;C08K5/56;C08L83/05;H01L23/29;H01L23/31;H01L33/48 |
主分类号 |
C08L83/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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