| 摘要 |
A method for plating a wiring board is provided. In the method, to selectively plate a plating target area on the wiring board wherein a circuit pattern having an unevenness of 25μm or more is formed on an insulating base material, areas other than the plating target area are masked. For masking, a masking film wherein an adhesive layer and a releasing sheet are laminated in sequence on one surface of a polybutylene terephthalate film is used.After removing the releasing sheet of the masking film, the adhesive layer surface of the masking film is bonded to a prescribed area on the wiring board under the thermoneutral environment, the work is bonded by thermocompression bonding, then, the plating target area is plated. A wiring board using such plating method is also provided. An area not to be plated is not plated by entry of a plating solution, even a wiring board has a large unevenness in a circuit pattern. Furthermore, the masking film has excellent blanking workability, and generation of especially a bur and a hole is prevented. |
