ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is an electronic component wherein a highly reliable airtight sealing structure can be obtained in a short time. A first sealing frame (16) formed on a main substrate (12) and a second sealing frame (19) formed on a cover substrate (13) are both composed of an Ni film.  For instance, a Bi layer (26) is formed on the first sealing frame (16), and an Au layer (27) is formed on the second sealing frame (19), and a bonding section (24) which bonds the first sealing frame (16) and the second sealing frame (19) to each other is formed by heating the first sealing frame (16) and the second sealing frame (19) at a temperature of, for instance, 300°C for 10 seconds, while pressurizing the frames in a direction wherein the frames are brought close to each other.  The bonding section (24) is composed of a mixed layer (28) which contains an alloy wherein an Ni-Bi-Au ternary alloy and Au2Bi are mixed as a main component.