| 摘要 |
A laser marking method and a laser marking system are provided. The laser marking method includes the following steps. Firstly, a substrate having at least M pattern lines is provided, wherein M is an integer which is larger than or equal to 1. Next, a laser beam is provided. Then, the laser beam is divided into at least two laser sub-beams including a first laser sub-beam and a second laser sub-beam. Afterwards, the second laser sub-beam is aimed at an (N-M)-th pattern line, and an N-th pattern line is marked by the first laser sub-beam, wherein N is an integer which is larger than or equal to M.
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