| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical transmission device to be mounted on a circuit board, to achieve direct connection of lead conductors, to be mounted so that the heat radiation direction thereof is above the mounting surface of the circuit board, and to be assembled in the same manner as usual. Ž<P>SOLUTION: The optical transmission device includes: a package 21 containing at least a light emitting element 22 and a carrier 23 mounting the light emitting element 22 thereon; and a lid 29 sealed by seam welding. Wherein, lead conductors 26 for connection to an external circuit are drawn out from the package via respective wiring conductors 27 disposed within an insulating block 25, at positions of a height equal to or higher than that of the external surface of the lid 29 of the package 21, and a clearance groove 30 enabling seam welding of the lid 29 is disposed between the insulating block 25 and the package 21. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
