CAMERA MODULE OF METHOD FOR MANUFACUTURING THE SAME

摘要

PURPOSE: A camera module is provided to perform casing process and bonding process of ground pad on a wafer substrate. CONSTITUTION: An image sensor module(140) comprises a substrate, image sensor, ground pad, and sealing member. The image sensor is loaded on the upper surface of the substrate. The ground pad is placed at the lower surface of the substrate. The sealing member seals image sensor. The lens member(160) is laminated on the image sensor module. A conductive member(170) is electrically connected with the ground pad.