发明名称 PRESS FORGED METAL HOUSING FOR LEDS AND AN LED METAL PACKAGE USING THE METAL HOUSING
摘要 Disclosed are an LED (Light Emitting Diode) metal housing produced by press forging according to the present invention and an LED metal package using the metal housing, wherein the LED housing comprises a housing body having a chip mount part formed on a central portion of the top surface to receive one or more LED chips therein, and a reflective protrusion integrally formed outside the chip mount part on the top surface of the housing body, the integrated housing body and reflective protrusion being made out of a metallic material.  By forming the housing body where one or more LED chips are mounted and the reflective protrusion from a metallic material, the present invention makes it possible to unify and standardize the volume (size) of LED housings.  Advantages of standardized LED housings include automatic mounting of LED chips, automatic connection of electrode lines between LED chips and terminals, automatic mounting of an external terminal and an increase in automated operation rate of a series of resin (casting resin or silicon) coating processes.  These result in an improved yield and reduced material costs.  Moreover, the housing and reflective protrusion formed from a metallic material can not only increase the illuminance on a reflection surface and further the luminance of an optical element package, but also prevent luminance degradation and utilizes LED-generated light in an efficient way.
申请公布号 WO2009136716(A3) 申请公布日期 2010.02.18
申请号 WO2009KR02347 申请日期 2009.05.04
申请人 YUN, SUNG NO;KIM, MIN KONG 发明人 YUN, SUNG NO;KIM, MIN KONG
分类号 H01L33/00;H01L33/48;H01L33/60;H01L33/64 主分类号 H01L33/00
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