| 摘要 |
PROBLEM TO BE SOLVED: To improve resistance of electronic paper to external stress. SOLUTION: The resistance to external stress is increased by providing an element formation layer, which includes an integrated circuit part, a first electrode, a second electrode, and a charged particle-containing layer, between a first insulating film including a first structure body in which a first fibrous body is impregnated with a first organic resin, and a second insulating film including a second structure body in which a second fibrous body is impregnated with a second organic resin. COPYRIGHT: (C)2010,JPO&INPIT |
