发明名称 Plasma processing method and plasma processing apparatus for performing accurate end point detection
摘要 In a plasma processing method, a correlation between substrate type data and optical data is obtained by using a multivariate analysis; substrate type data is obtained from optical data based on the correlation when initiating a plasma processing; and a substrate type is determined by using the obtained substrate type data. Further, a setting data set corresponding to the determined substrate type is selected from setting data sets, each for detecting a plasma processing end point of the plasma processing, each of the setting data sets being stored in advance in a data storage unit; an end point of the plasma processing is detected based on the selected setting data set; and the plasma processing is terminated at the detected end point.
申请公布号 US7662646(B2) 申请公布日期 2010.02.16
申请号 US20070687428 申请日期 2007.03.16
申请人 TOKYO ELECTRON LIMITED 发明人 OGASAWARA KOSUKE;SAITO SUSUMU;NOZAWA SYUJI
分类号 H01L21/00 主分类号 H01L21/00
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