| 摘要 |
<p>Heat-hardening epoxide resin composition (Q) comprises: (a) at least an epoxide resin with an average of more than one epoxide group per molecule; (b) at least one hardener for epoxy resins, where the hardener: is activated at high temperature, and is an amine, amide, carboxylic acid anhydride or polyphenol; (c) at least one amide group containing catalyst (I); and (d) tenacity improver. Heat-hardening epoxide resin composition (Q) comprises: (a) at least an epoxide resin with an average of more than one epoxide group per molecule; (b) at least one hardener for epoxy resins, where the hardener: is activated at high temperature, and is an amine, amide, carboxylic acid anhydride or polyphenol; (c) at least one amide group containing catalyst (I) of formula ((R 1>-NH-C(=O)-N(R 2>)(R 3>)) n) (Ia) or ((R1a-N(R2a)-C(=O)-N(R3a)) m) (Ib); and (d) tenacity improver. R 1>H or a n-valent aliphatic, cycloaliphatic or araliphatic residue; either R 2>, R 3>alkyl or aralkyl; or R 2>R 3>a bivalent 3-20C-aliphatic residue, whose one part is optionally substituted by 5-8, preferably 6 membered heterocyclic ring; R1a : m-valent aliphatic, cycloaliphatic or araliphatic residue; R2a : alkyl, aralkyl or alkylene group; R3a : H, alkyl or aralkyl; and n, m : 1-4, preferably 1 or 2. Independent claims are included for: (1) a process for adhering heat stable materials, preferably metals, comprising contacting the materials with (Q) and hardening at 100-220, preferably 120-200[deg] C; (2) an adhered article, obtained by the above process; and (3) foamed articles, which is obtained by partially filling the cavities with (Q) and heating the adhered material at 100-220, preferably 120-200[deg] C.</p> |
