| 摘要 |
<p>Disclosed is a film for metal film transfer, which has excellent transferability of a metal film layer. Also disclosed is a method for efficiently manufacturing a circuit board by using such a film for metal film transfer. Specifically disclosed is a film for metal film transfer, which is characterized by having a support layer, a release layer formed on the support layer from one or more water-soluble polymers selected from the group consisting of water-soluble cellulose resins, water-soluble polyester resins and water-soluble acrylic resins, and a metal film layer formed on the release layer. Also specifically disclosed is a method for manufacturing a circuit board, which comprises a step for arranging the film for metal film transfer on a curable resin composition layer on a substrate in such a manner that the metal film layer is in contact with the surface of the curable resin composition layer and curing the curable resin composition layer; a step for separating the support layer; and a step for dissolving and removing the release layer present on the metal film layer by using an aqueous solution.</p> |
