| 摘要 |
PROBLEM TO BE SOLVED: To improve solderability, while shortening time required for a process for mounting a bus bar. SOLUTION: In an invertor device 1, namely a semiconductor device, the junction structure of the bus bar 20bu for joining a U-phase terminal 20U to an electronic circuit board 14 is formed by providing an opposite section 31 separated from the electronic circuit board 14 and disposed nearly in parallel in the bus bar 20bu, and by overlapping an opening 36 comprising a through-hole to the opposite section 31 on the electronic circuit board 14. One portion of hot blast supplied from a lower side in a reflow furnace is blown to the opposite section 31 through the opening 36 to heat up the bus bar 20bu. The heat quickens fusing of solder 34 to join the bus bar 20bu to the electronic circuit board 14. COPYRIGHT: (C)2010,JPO&INPIT |
