发明名称 |
DESTRUCTOR INTEGRATED CIRCUIT CHIP, INTERPOSER ELECTRONIC DEVICE AND METHODS |
摘要 |
A semiconductor chip includes a first integrated circuit chip and a depression substrate attached to the integrated circuit chip, wherein the integrated circuit chip and the depression substrate define a cavity therebetween. The semiconductor chip also includes a stress sensitive material located in the cavity and a chemical located in the cavity, wherein detection of tampering causes a reaction by the chemical such that the semiconductor chip is at least partially destroyed.
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申请公布号 |
US2010032776(A1) |
申请公布日期 |
2010.02.11 |
申请号 |
US20050043626 |
申请日期 |
2005.01.25 |
申请人 |
TELEDYNE TECHNOLOGIES INCOPORATED |
发明人 |
PHAM CUONG V.;CHUBIN DAVID E.;KUAN AARON D.;KHALIFA COLLEEN L. |
分类号 |
H01L23/06 |
主分类号 |
H01L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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