发明名称 |
Module component and method for manufacturing the same |
摘要 |
A module component in which mounting components and a conductive partition for dividing into a plurality of circuit blocks are mounted on a substrate. The circuit blocks are covered with a sealing member, which is further covered on its surface with a conductive film to electrically shield the circuit blocks individually. This module component can maintain bending strength, with little warpage by a sufficient shielding effect achieved without increasing the number of manufacturing processes.
|
申请公布号 |
US7659604(B2) |
申请公布日期 |
2010.02.09 |
申请号 |
US20050549996 |
申请日期 |
2005.09.19 |
申请人 |
PANASONIC CORPORATION |
发明人 |
FUJIWARA JOJI;HIMORI TSUYOSHI;TSUNEOKA MICHIAKI |
分类号 |
H01L23/552;H01L23/29;H01L23/31;H01L23/498;H05K1/02;H05K3/28;H05K9/00 |
主分类号 |
H01L23/552 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|