发明名称 Heat dissipating member, heat dissipating mechanism, and information processing apparatus
摘要 A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an inner space of the apparatus to the outside regardless of the layout position of the unit by using the heat dissipating mechanism fixed to a unit and a heat dissipation surface so that the heat is transferred from the unit to the heat dissipation surface.
申请公布号 US7660114(B2) 申请公布日期 2010.02.09
申请号 US20080108103 申请日期 2008.04.23
申请人 RICOH COMPANY, LTD. 发明人 WATANABE HAYATO;ODANAKA SATOSHI
分类号 H05K7/20;H01L23/34 主分类号 H05K7/20
代理机构 代理人
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