| 摘要 |
PURPOSE: A method and apparatus of molding an electronic device are provided to reduce the deformation of the electronic component by cooling molding resin under the set temperature. CONSTITUTION: The lower mold(11) accepts the molding resin. The upper mold(13) grips the electronic component. The electronic component is dipped in the molding resin of the lower mold. The loader(15) loads the electronic component to the upper mold or unloads the electronic component from the upper mold. The cooling unit(31) cools the electronic component having in the state gripped in the upper mold.
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