| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an aqueous dispersion for chemical mechanical polishing and a chemical mechanical polishing method using the same which reduce a polishing speed for a low-permittivity insulation film, achieve both high polishing speed and high planarization characteristics for an interlayer insulation film (a cap layer) such as a barrier metal film and TEOS film, and suppress occurrence of surface defects such as dishing, erosion, scratch and fang. <P>SOLUTION: The aqueous dispersion for chemical mechanical polishing contains (A) silica particles, (B) an organic acid, and (C) a water soluble polymer having a weight-average molecular weight of 50,000-5,000,000. The silica particles (A) have such a chemical property that a silanol group density thereof as calculated based on a specific surface area measured by using a BET method and an amount of silanol groups measured by titration is 1.0-3.0 pieces/nm<SP>2</SP>. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
