OPTOELECTRONIC SEMICONDUCTOR COMPONENT

摘要

The invention relates to an optoelectronic semiconductor component, having - a connection carrier (2), - an optoelectronic semiconductor chip (1) disposed on a mounting surface (22) of the connection carrier (2), and - a body transparent to radiation (3) enclosing the semiconductor chip (1), wherein - the body transparent to radiation (3) comprises a silicone, - the body transparent to radiation (3) comprises at least one side surface (31) running at least in places at an angle (ß) < 90° to the mounting surface (22), and - the side surface (3) is generated by a singulation process.