| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module which has a simple configuration and has high-level operation reliability. SOLUTION: The application describes a power semiconductor module (10) which has a substrate (12), a package (14) and a bridge element (16). The package (14) can be fixed on a cooling component, The bridge element (16) is arranged in the package and is pressed with pushing elements (32) against the substrate (12). In addition, the bridge element (16) is provided for the purpose of positioning load connection elements (38) relative to interconnects (20) on the substrate (12). To ensure an outstanding dielectric strength or breakdown strength, the substrate (12) and the bridge element (16) form a unit (26), which is arranged in the package (14) with limited movement in all lateral directions. COPYRIGHT: (C)2010,JPO&INPIT
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