| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in fluidity, adhesiveness, dimensional stability and low stress, and an electronic component device. Ž<P>SOLUTION: The resin composition has a composition containing (A) an epoxy resin, (B) a curing agent, and (C) a silicone compound, wherein the component (C) contains (c1) a silicone compound having S-OH at both molecular ends and (c2) a compound expressed by general formula (I-2) and a compound expressed by general formula (I-3), wherein R<SP>2</SP>is selected from 1-8C divalent hydrocarbon groups which may have a substituent and R<SP>3</SP>is selected from 1-8C monovalent hydrocarbon groups which may have a substituent, and all of R<SP>3</SP>s may be the same or different from each other. and the electronic component device is also provided. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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