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发明名称
METHOD FOR FORMING METAL INTERCONNECTION LAYER OF SENICONDUCTOR DEVICE
摘要
申请公布号
KR100940417(B1)
申请公布日期
2010.02.02
申请号
KR20070139165
申请日期
2007.12.27
申请人
发明人
分类号
H01L21/3205
主分类号
H01L21/3205
代理机构
代理人
主权项
地址
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