| 发明名称 |
CROSS CONNECT VIA FOR MULTILAYER PRINTED CIRCUIT BOARDS |
| 摘要 |
A printed circuit board (B) with a mechanical attachment of connector pins (42a and 42b) to opposite sides of the same plated through location (34) maintains electrical isolation between the board sides (14 and 16). A sequence of controlled depth drilling steps creates a hole (34) through the printed circuit board (B) with multiple diameters (20, 24, 30 and 40). |
| 申请公布号 |
WO2004054333(A3) |
申请公布日期 |
2004.11.04 |
| 申请号 |
WO2003US34745 |
申请日期 |
2003.10.31 |
| 申请人 |
LITTON SYSTEMS INC |
发明人 |
VETTER STEPHEN;MURRY THOMAS;LATALL RANDOLPH;COOK SHARON;MONTGOMERY ERIC |
| 分类号 |
H01R12/51;H05K1/02;H05K1/11;H05K3/00;H05K3/42 |
主分类号 |
H01R12/51 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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