发明名称 PRINTED CIRCUIT BOARD WITH EXCELLENT HEAT-DISSIPATING
摘要 PURPOSE: A printed circuit board with excellent heat-dissipating is provided to release efficiently the heat generating from the electronic component through the metal penetration post outside the print circuit board. CONSTITUTION: The conductive metal layer(12) has the at least one side of the print circuit board and the insulating substrate(10). In the conductive metal layer, the outside and the inner lead part is formed in a plurality of wiring patterns. When the electronic component is mounted in the metal penetration post, an electronic part reserved area is inserted in order to come in contact with each other through the electronic component and abutment portion. The metal penetration post passes through inside and outside side of the print circuit board.
申请公布号 KR20100007729(A) 申请公布日期 2010.01.22
申请号 KR20090060564 申请日期 2009.07.03
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 KATAOKA TATSUO
分类号 H05K1/02;H05K7/20 主分类号 H05K1/02
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