发明名称 |
SEMICONDUCTOR DEVICE PACKAGE WITH INSULATOR RING |
摘要 |
Embodiments provide a semiconductor device package and a method for fabricating thereof. The package includes a silicon substrate having a semiconductor device and a metal layer thereon; an insulator ring formed in the silicon substrate and surrounding a portion of a silicon material below the metal layer; and a conductive layer disposed below a backside of the silicon substrate and extended to contact the portion of the silicon material surrounded by the insulator ring below the metal layer.
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申请公布号 |
US2010013080(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20090565470 |
申请日期 |
2009.09.23 |
申请人 |
CHIEN WEN-CHENG;HUANG WANG-KEN |
发明人 |
CHIEN WEN-CHENG;HUANG WANG-KEN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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