| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching liquid, wherein an Ni alloy, a Cr alloy, an Ni-Cr alloy and a Cr simple substance are an Ni alloy, a Cr alloy, an Ni-Cr alloy and a Cr simple substance are selectively dissolved without dissolving a metal including copper and the problems of an etching waste liquid are solved, in etching treatment for a composed body in which the lower layer of copper wiring is provided with a substrate metal layer of an Ni-Cr alloy such as a flexible wiring board. SOLUTION: Disclosed is the etching liquid which is composed of an acidic solution containing a permanganate of 0.05 to 10 wt.% and hydrochloric acid of 0.005 to 2 wt.%, and selectively dissolves an Ni alloy, a Cr alloy, an Ni-Cr alloy or a Cr simple substance without dissolving a copper alloy or a copper simple substance, and is used in an etching stage for a wiring board provided with conductive copper wiring. COPYRIGHT: (C)2010,JPO&INPIT
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