发明名称 SOLDER JET STREAM FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To form uniform stable jet stream on a blow port by jetting molten solder from each part of the blow port of a blow port body for forming the jet stream with uniform pressure and speed and achieve soldering having uniform soldering quality at any position of a printed wiring board in a flow soldering method. Ž<P>SOLUTION: In a solder jet stream forming device for forming the jet stream of the molten solder on the blow port of the blow port body by connecting a molten solder supply means with the blow port body, the solder jet stream forming device has a meandering channel between the blow port and the molten solder supply means, and the meandering channel is formed by making a length of a channel shorter or the longitudinal cross-section of the channel larger at a position having larger supply pressure of the molten solder which is supplied to the blow port from the molten solder supply means. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010012477(A) 申请公布日期 2010.01.21
申请号 JP20080172289 申请日期 2008.07.01
申请人 NIPPON DENNETSU CO LTD 发明人 SHINDO YOSHIHIKO
分类号 B23K1/08;H05K3/34 主分类号 B23K1/08
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