STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING A STACKED PACKAGE STRUCTURE

摘要

PURPOSE: A laminated package structure and a laminated package structure manufacturing method are provided to reduce the fabrication time of a laminated package structure by simultaneously forming a first sealing member and a second sealing member after laminating the first package and the second package. CONSTITUTION: A laminated package structure comprises a first wiring substrate(110), a first package, and a second package. A trench is formed on the upper side of the first wiring substrate. The first package comprises a first chip and a first connection member which electrically connects the first wiring substrate and the first chip. The second package comprises a second chip and a second connecting member which electrically connects the second chip and the second wiring substrate. The second package is laminated on the first package in order to electrically connect the first wiring substrate and the second wiring substrate.