| 摘要 |
PURPOSE: A protective film coating apparatus for a wafer and a laser processing apparatus are provided to reduce the amount of used liquid resin by spraying the liquid resin like fog. CONSTITUTION: A protective film coating apparatus for a wafer comprises a spinner table and a coating unit. The spinner table rotates a wafer by sucking the water. The coating unit spreads liquid resin over the wafer holed on the spinner table. The coating unit includes a sprayer which sprays the liquid resin like fog, an arm(70) which supports the sprayer, and a first swing unit which horizontally swings the sprayer supported on the arm from the rotation center of the wafer to the perimeter.
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