| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board, an electronic instrument and a semiconductor package, that are excellent in bonding strength and easy in rework. <P>SOLUTION: The printed circuit board 5 includes a printed wiring board 11, an electronic component 12 that is the semiconductor package, and an adhesion part 13. A protection member 24 of the electronic component 12 is arranged along the peripheral edge of a mounting surface 22a of a package body 22 so as to be abutted to a mounting surface 11a of the printed wiring board 11. The adhesion part 13 is provided in a stepped part 33 defined by a peripheral wall 30 of the electronic component 12 and part of the mounting surface 11a of the printed wiring board 11 in the vicinity of the electronic component 12. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
