| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method of an Si substrate, wherein a protective film is hardly peeled off during laser irradiation, the substrate is surely protected from adhesion of debris, and the high yield and reliability are maintained. <P>SOLUTION: The laser beam machining method of an Si substrate includes: a process of forming a protective film 2 of a thickness≤250 nm on the surface of a mono-crystal Si substrate 1 by coating with a spin coater an aqueous solution of hydrophilic resin such as polyvinyl alcohol and polyvinyl pyrrolidone; a process of boring by irradiating the Si substrate 1 with a pulsed laser beam 3 through the protective film 2, and a process of removing the protective film 2 by dissolving in a solvent like pure water. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
