| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To separate a support plate from a wafer where the support plate is stuck without breaking the wafer. <P>SOLUTION: A separating apparatus 1 includes a clamp 2 gripping the outer-periphery-side end of the support plate 7. The clamp 2 grips the outer-periphery-side end of the support plate 7 to separate the gripped support plate 7 from the wafer 6. Consequently, the support plate 7 is separated from the wafer 6 without breaking the wafer 6. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
