| 摘要 |
<p>A catalyst-imparting liquid is provided. When electroless reductional palladium plating is conducted directly on a copper-based-conductor circuit material, the catalyst-imparting liquid enables an even coating film free from thickness unevenness to be deposited without bridging fine wiring lines. When the electroless reductional palladium plating is followed by electroless gold plating and then by soldering to the resultant deposit, a coating film having no voids can be formed. The catalyst-imparting liquid is used for conducting electroless reductional palladium plating on a copper-based metal. The catalyst-imparting liquid is characterized by containing, as constituent ingredients, a water-soluble gold compound, a heterocyclic compound having a five-membered ring structure including two or more nitrogen atoms, and a chelating agent having an iminodiacetic acid structure. Also provided are: a process for producing a palladium deposit on a copper-based metal, characterized by using the catalyst-imparting liquid to conduct electroless reductional palladium plating on the copper-based metal; and a palladium deposit produced on a copper-based metal by the process.</p> |
