发明名称 |
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME |
摘要 |
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
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申请公布号 |
US2010006625(A1) |
申请公布日期 |
2010.01.14 |
申请号 |
US20090476925 |
申请日期 |
2009.06.02 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
EOM YONG SUNG;MOON JONG TAE;OH SANGWON;JANG KEONSOO |
分类号 |
B23K31/02;B23K1/20;B23K35/34 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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