发明名称 ADHESIVE COMPOSITION, ADHESIVE SHEET, AND DICING DIE ATTACH FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in not only adhesiveness but embedding performance and heat resistance, and to provide an adhesive sheet and a dicing die attach film using the above adhesive composition. Ž<P>SOLUTION: The adhesive composition includes (A) a (meth)acrylic resin having a weight average molecular weight of 50,000 to 1,500,000 and containing a functional group having reactivity with one of or both of the following (B) and (C) components, (B) an epoxy resin having a weight average molecular weight of not more than 5,000, and (C) an aromatic polyamine compound. The adhesive sheet comprises a base material and a layer made of the above adhesive composition provided on the base material. The dicing die attach film comprises a dicing film having a base material and a pressure-sensitive adhesive layer formed thereon, and a layer made of the above adhesive composition provided on the pressure-sensitive adhesive layer of the dicing film. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010006929(A) 申请公布日期 2010.01.14
申请号 JP20080166958 申请日期 2008.06.26
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 KOUCHI SATOSHI;KOSAKAI SHOHEI
分类号 C09J133/00;C09J7/00;C09J7/02;C09J133/18;C09J163/00;C09J179/02;C09J181/06;C09J201/00;H01L21/301;H01L21/52 主分类号 C09J133/00
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