| 摘要 |
A sputtering apparatus includes: a film forming chamber that houses a substrate hold so as to be capable of being carried in a horizontal direction; a sputtered particle ejecting section that includes an upper target and a lower target that are disposed so as to face each other and oblique to the substrate, and an opening, and in which sputtered particles are generated from a pair of the targets by plasma, and the sputtered particles are ejected from the opening to the substrate carried from a side adjacent to the upper target to another side adjacent to the lower target; and a slit member that has a slit through which the sputtered particles are selectively passed, and is disposed between the substrate and the sputtered particle ejecting section. The slit member is disposed so that a slit open end of the slit is positioned within 50 mm from an upstream open end of the opening of the sputtered particle ejecting section, and the slit open end is positioned at an upstream side in a carrying direction of the substrate.
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