| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component module having a high reliability. <P>SOLUTION: The electronic component module 10 includes: a wiring board 1 with a plurality of external connection pads 6 electrically connected with wiring conductors 9 at the outer circumferentail part on the lower surface of an insulating board 1 with the wiring conductor 9 formed; a plurality of electronic component element 40 including at least one of a sensor element 2 and a semiconductor device 3 so mounted on the upper surface of the wiring board 1 as to be electrically connected to the wiring conductor 9; and a large external connection pad 6a formed in the region facing a region on the lower surface of the wiring board 1 with the sensor element 2 and/or the semiconductor device 3 mounted. The most of the stress applied to the region is given to the large external connection pad 6a and is distributed due to the large external connection pad 6a formed in the region facing the region with the sensor element 2 and the semiconductor device 3 to prevent the exfoliation of the part of the external connection pad 6 caused by the concentration of the stress. <P>COPYRIGHT: (C)2010,JPO&INPIT |
