| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polymer usable in a weak-alkali-developable photosensitive resin composition forming a solder resist having sufficiently high heat resistance and thermal shock resistance, and forming a dry film exhibiting excellent storage stability. <P>SOLUTION: The polymer comprises a structure represented by general formula (1), wherein X and Y denote each a divalent organic group; R denotes H, phenyl or 1-5C alkyl; and n denotes an integer of ≥1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
