PHOTOSENSITIVE POLYORGANOSILOXANE COMPOSITION, POLYORGANOSILOXANE-CURED RELIEF PATTERN AND METHOD FOR FORMING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive polyorganosiloxane composition which has excellent wettability when applied onto an organic thin film, excellent photosensitive properties when received UV-i light and excellent adhesiveness to the organic thin film and which is curable at low temperature, and to provide a polyorganosiloxane-cured relief pattern formed by using the photosensitive polyorganosiloxane composition, a method for forming the polyorganosiloxane-cured relief pattern, a semiconductor device and a method for producing the semiconductor device.

SOLUTION: The photosensitive polyorganosiloxane composition includes (a) 100 parts mass polysiloxane obtained by polymerizing a silanol compound having a specific structure and an alkoxysilane compound having another specific structure in the presence of a catalyst without adding water, (b) 0.2-20 parts mass photopolymerization initiator, (c) 0.01-10 parts mass nonionic surfactant and (d) 10-150 parts mass at least one organic solvent selected from compounds each having an alcoholic hydroxy group and ketone compounds.

COPYRIGHT: (C)2010,JPO&INPIT