发明名称 SYSTEM IN PACKAG MODULE AND PORTABLE COMMUNICATION TERMINAL HAVING THE SAME
摘要 PURPOSE: A system in packing a module and a portable communication terminal having the same are provided to reduce the number of main boards by mounting a system in package module stacking at least three elements in a main board. CONSTITUTION: A first device(122a) is arranged at a system circuit substrate. A second device(122b) is shifted to the center of a first device and exposes the part of the first element. A second device is arranged on a first device. A third device(122c) is electrically touched with a circuit pattern. A third device is arranged on the second device, and a bumper pad is arranged on the bottom of the system circuit.
申请公布号 KR20100004612(A) 申请公布日期 2010.01.13
申请号 KR20080064878 申请日期 2008.07.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, TAE HYUN;KWON, SUNG TAEK;LEE, TAE HA;KIM, DONG KUK
分类号 H01L23/12 主分类号 H01L23/12
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